Invention Grant
- Patent Title: Etching resist
- Patent Title (中): 蚀刻抗蚀剂
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Application No.: US12638349Application Date: 2009-12-15
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Publication No.: US08734964B2Publication Date: 2014-05-27
- Inventor: Kazuma Kurihara , Takashi Nakano , Takayuki Shima , Junji Tominaga , Kazuya Fujioka , Ichiro Suehiro
- Applicant: Kazuma Kurihara , Takashi Nakano , Takayuki Shima , Junji Tominaga , Kazuya Fujioka , Ichiro Suehiro
- Applicant Address: JP Tokyo JP Ibaraki-shi
- Assignee: National Institute of Advanced Industrial Science and Technology,Nitto Denko Corporation
- Current Assignee: National Institute of Advanced Industrial Science and Technology,Nitto Denko Corporation
- Current Assignee Address: JP Tokyo JP Ibaraki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-330431 20081225
- Main IPC: B32B3/00
- IPC: B32B3/00 ; C23F1/08 ; C23F1/00 ; C01B21/20
Abstract:
An etching resist has a first heat-generating layer, a second heat-generating layer, and a metal compound layer including a metallic oxynitride layer containing a metallic oxynitride. The first heat-generating layer, the metallic oxynitride layer, and the second heat-generating layer are directly or indirectly laminated such that the metallic oxynitride layer is positioned between the first heat-generating layer and the second heat-generating layer.
Public/Granted literature
- US20100167015A1 ETCHING RESIST Public/Granted day:2010-07-01
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