Invention Grant
US08735045B2 Positive resist composition, method of forming resist pattern, and polymeric compound
有权
正型抗蚀剂组合物，形成抗蚀剂图案的方法和聚合物
- Patent Title: Positive resist composition, method of forming resist pattern, and polymeric compound
- Patent Title (中): 正型抗蚀剂组合物，形成抗蚀剂图案的方法和聚合物
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Application No.: US12911411Application Date: 2010-10-25
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Publication No.: US08735045B2Publication Date: 2014-05-27
- Inventor: Tomoyuki Hirano , Daiju Shiono , Daichi Takaki
- Applicant: Tomoyuki Hirano , Daiju Shiono , Daichi Takaki
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2009-248210 20091028
- Main IPC: G03F7/00
- IPC: G03F7/00 ; C08F228/02 ; C08F226/02 ; C08F220/10
Abstract:
A positive resist composition including a base component (A) which exhibits increased solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the base component (A) including a polymeric compound (A1) containing a structural unit (a0) represented by general formula (a0-1) shown below and a structural unit (a1) derived from an acrylate ester containing an acid dissociable, dissolution inhibiting group.
Public/Granted literature
- US20110097667A1 POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND Public/Granted day:2011-04-28
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