Invention Grant
US08735188B2 Apparatus for atomic layer deposition with sloped purge injection nozzle structure
有权
用于原子层沉积的设备，具有倾斜的吹扫喷嘴结构
- Patent Title: Apparatus for atomic layer deposition with sloped purge injection nozzle structure
- Patent Title (中): 用于原子层沉积的设备，具有倾斜的吹扫喷嘴结构
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Application No.: US13347439Application Date: 2012-01-10
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Publication No.: US08735188B2Publication Date: 2014-05-27
- Inventor: Seung-Hun Kim , Sang-Joon Seo , Jin-Kwang Kim , Jun-Hyuk Cheon
- Applicant: Seung-Hun Kim , Sang-Joon Seo , Jin-Kwang Kim , Jun-Hyuk Cheon
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: KR10-2011-0064229 20110630
- Main IPC: H01L33/52
- IPC: H01L33/52
Abstract:
An atomic layer deposition apparatus and a sealing method of an organic light emitting device using the same are disclosed. In one embodiment, the atomic layer deposition apparatus improves a structure of the purge gas injection nozzle so as to increase the exhaust efficiency of the purge gas in an atomic layer deposition process, which increases a speed of a purge process. As a result, it is possible to improve a deposition speed and a quality of a sealing film when a sealing process for sealing the organic light emitting device is implemented by using the atomic layer deposition.
Public/Granted literature
- US20130005057A1 APPARATUS FOR ATOMIC LAYER DEPOSITION Public/Granted day:2013-01-03
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