Invention Grant
- Patent Title: Wafer-scaled light-emitting structure
- Patent Title (中): 晶圆尺寸发光结构
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Application No.: US13662545Application Date: 2012-10-29
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Publication No.: US08735197B2Publication Date: 2014-05-27
- Inventor: Chin-San Tao , Tzu-Chien Hsu , Tsen-Kuei Wang
- Applicant: Epistar Corporation
- Applicant Address: TW Hsinchu
- Assignee: Epistar Corporation
- Current Assignee: Epistar Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW97129479A 20080801
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
This invention discloses a wafer-scaled light-emitting structure comprising a supportive substrate; an anti-deforming layer; a bonding layer; and a light-emitting stacked layer, wherein the anti-deforming layer reduces or removes the deformation like warp caused by thinning of the substrate.
Public/Granted literature
- US20130099268A1 WAFER-SCALED LIGHT-EMITTING STRUCTURE Public/Granted day:2013-04-25
Information query
IPC分类:
