Invention Grant
- Patent Title: Semiconductor devices and methods of assembling same
- Patent Title (中): 半导体器件及其组装方法
-
Application No.: US13398811Application Date: 2012-02-16
-
Publication No.: US08735223B2Publication Date: 2014-05-27
- Inventor: Wei Gao , Zhiwei Gong , Dehong Ye , Huchang Zhang
- Applicant: Wei Gao , Zhiwei Gong , Dehong Ye , Huchang Zhang
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent Charles Bergere
- Main IPC: H01L29/66
- IPC: H01L29/66
Abstract:
A method of forming a semiconductor device includes affixing a die to a heat sink to form a die and heat sink assembly and then placing the die and heat sink assembly on a support element. A semiconductor device includes a die and heat sink assembly disposed on a support element. The die and heat sink assembly is pre-assembled prior to being disposed on the support element.
Public/Granted literature
- US20130056861A1 SEMICONDUCTOR DEVICES AND METHODS OF ASSEMBLING SAME Public/Granted day:2013-03-07
Information query
IPC分类:
