Invention Grant
US08735224B2 Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof
有权
具有路由电路引线阵列的集成电路封装系统及其制造方法
- Patent Title: Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof
- Patent Title (中): 具有路由电路引线阵列的集成电路封装系统及其制造方法
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Application No.: US13102044Application Date: 2011-05-05
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Publication No.: US08735224B2Publication Date: 2014-05-27
- Inventor: Byung Tai Do , Arnel Senosa Trasporto , Zigmund Ramirez Camacho
- Applicant: Byung Tai Do , Arnel Senosa Trasporto , Zigmund Ramirez Camacho
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
A method of manufacture of an integrated circuit packaging system includes: providing a terminal having a top with a depression; applying a dielectric material in the depression, the dielectric material having a gap formed therein and exposing a portion of the top therefrom; forming a trace within the gap and in direct contact with the top, the trace extending laterally over an upper surface of the dielectric material; and connecting an integrated circuit to the terminal through the trace.
Public/Granted literature
- US20120280390A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTED CIRCUIT LEAD ARRAY AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2012-11-08
Information query
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