Invention Grant
- Patent Title: Integrated circuit resistor fabrication with dummy gate removal
- Patent Title (中): 集成电路电阻制造与虚拟门去除
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Application No.: US13343903Application Date: 2012-01-05
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Publication No.: US08735258B2Publication Date: 2014-05-27
- Inventor: Chun-Hung Ko , Jyh-Huei Chen , Shyh-Wei Wang
- Applicant: Chun-Hung Ko , Jyh-Huei Chen , Shyh-Wei Wang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/20

Abstract:
Methods of fabricating a semiconductor device including a metal gate transistor and a resistor are provided. A method includes providing a substrate including a transistor device region and an isolation region, forming a dummy gate over the transistor device region and a resistor over the isolation region, and implanting the resistor with a dopant. The method further includes wet etching the dummy gate to remove the dummy gate, and then forming a metal gate over the transistor device region to replace the dummy gate.
Public/Granted literature
- US20130178039A1 INTEGRATED CIRCUIT RESISTOR FABRICATION WITH DUMMY GATE REMOVAL Public/Granted day:2013-07-11
Information query
IPC分类: