Invention Grant
- Patent Title: Temporary adhesive composition and method for manufacturing thin wafer using the same
- Patent Title (中): 临时粘合剂组合物及其制造方法
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Application No.: US13628678Application Date: 2012-09-27
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Publication No.: US08735264B2Publication Date: 2014-05-27
- Inventor: Hiroyuki Yasuda , Masahiro Furuya , Michihiro Sugo , Shohei Tagami , Hideyoshi Yanagisawa
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2011-223233 20111007
- Main IPC: C09J183/04
- IPC: C09J183/04 ; H01L21/762 ; C08K5/01 ; C08K5/105 ; C08K5/101 ; C08K5/37
Abstract:
The present invention is a temporary adhesive composition comprising: (A) non-aromatic saturated hydrocarbon group-containing organopolysiloxane; (B) an antioxidant; and (C) an organic solvent, wherein the component (A) corresponds to 100 parts by mass, the component (B) corresponds to 0.5 to 5 parts by mass, and the component (C) corresponds to 10 to 1000 parts by mass. There can be provided a temporary adhesive composition that has excellent thermal stability while maintaining solvent resistance and a method for manufacturing a thin wafer using this.
Public/Granted literature
- US20130089967A1 TEMPORARY ADHESIVE COMPOSITION AND METHOD FOR MANUFACTURING THIN WAFER USING THE SAME Public/Granted day:2013-04-11
Information query
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