Invention Grant
- Patent Title: Chemical mechanical polishing composition and methods relating thereto
- Patent Title (中): 化学机械抛光组合物及其相关方法
-
Application No.: US12264928Application Date: 2008-11-05
-
Publication No.: US08735293B2Publication Date: 2014-05-27
- Inventor: Zhendong Liu
- Applicant: Zhendong Liu
- Applicant Address: US DE Newark
- Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Current Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Current Assignee Address: US DE Newark
- Agent Thomas S. Deibert
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461 ; H01L21/321 ; H01L45/00 ; C09K13/02 ; C09G1/02
Abstract:
A method for chemical mechanical polishing of a substrate comprising a germanium-antimony-tellurium chalcogenide phase change alloy using a chemical mechanical polishing composition comprising water; 1 to 40 wt % colloidal silica abrasive particles having an average particle size of ≦50 nm; and 0 to 5 wt % quarternary ammonium compound; wherein the chemical mechanical polishing composition is oxidizer free and chelating agent free; and, wherein the chemical mechanical polishing composition has a pH >6 to 12.
Public/Granted literature
- US20100112906A1 Chemical mechanical polishing composition and methods relating thereto Public/Granted day:2010-05-06
Information query
IPC分类:
