Invention Grant
US08735309B2 Mullite-based sintered body, circuit board using same and probe card
有权
莫来石基烧结体,使用电路板和探针卡
- Patent Title: Mullite-based sintered body, circuit board using same and probe card
- Patent Title (中): 莫来石基烧结体,使用电路板和探针卡
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Application No.: US13498571Application Date: 2011-09-28
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Publication No.: US08735309B2Publication Date: 2014-05-27
- Inventor: Yuya Furukubo , Toru Nakayama
- Applicant: Yuya Furukubo , Toru Nakayama
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: DLA Piper LLP (US)
- Priority: JP2010-217197 20100928
- International Application: PCT/JP2011/072246 WO 20110928
- International Announcement: WO2012/043658 WO 20120405
- Main IPC: C04B35/185
- IPC: C04B35/185 ; C04B35/462 ; G01R1/04

Abstract:
A mullite-based body including mullite, alumina, and titanium manganese oxide is disclosed. The mullite-based sintered body includes mullite of 79.3 to 85.2 mass %, alumina of 14.2 to 19.8 mass % and MnTiO3 of 0.6 to 1.1 mass %. The mullite-based sintered body has a relative density of 96% or higher. A circuit board and a probe card are also disclosed. The circuit board includes the mullite-based sintered body. The probe card includes the wiring substrate; a surface wiring layer on a surface of the wiring substrate; and a measuring terminal electrically coupled to the surface wiring layers for measuring the electrical characteristics of an electric circuit.
Public/Granted literature
- US20130176048A1 Mullite-Based Sintered Body, Circuit Board Using Same and Probe Card Public/Granted day:2013-07-11
Information query
IPC分类: