Invention Grant
US08735462B2 Radical-polymerizable resin, radical-polymerizable resin composition, and cured material thereof
有权
可自由基聚合树脂，自由基聚合性树脂组合物及其固化物
- Patent Title: Radical-polymerizable resin, radical-polymerizable resin composition, and cured material thereof
- Patent Title (中): 可自由基聚合树脂，自由基聚合性树脂组合物及其固化物
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Application No.: US13642363Application Date: 2011-03-28
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Publication No.: US08735462B2Publication Date: 2014-05-27
- Inventor: Tomoaki Mahiko , Yoshinori Funaki , Kiyoharu Tsutsumi , Naoko Araki
- Applicant: Tomoaki Mahiko , Yoshinori Funaki , Kiyoharu Tsutsumi , Naoko Araki
- Applicant Address: JP Osaka
- Assignee: Daicel Corporation
- Current Assignee: Daicel Corporation
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2010-096945 20100420
- International Application: PCT/JP2011/057634 WO 20110328
- International Announcement: WO2011/132504 WO 20111027
- Main IPC: C07D303/40
- IPC: C07D303/40 ; C08F2/46 ; C08G61/04
Abstract:
Provided is a radical-polymerizable resin capable of giving a cured material which is satisfactorily flexible, can relax stress upon usage as an adhesive, and does not cause disadvantages such as separation at the adhesive interface or breakage of an adherend, which stress occurs between the adhesive and the adherend upon heating or cooling and is caused by difference in coefficient of thermal expansion between them.The radical-polymerizable resin is obtained through cationic polymerization of a compound represented by any of following Formulae (1a) and (1b) and a compound represented by any of following Formulae (2a), (2b), (2c), (2d), (2e), and (2f). The radical-polymerizable resin is liquid at 0 ° C. and has a weight-average molecular weight of 500 or more. Symbols in the formulae are as defined in the description.
Public/Granted literature
- US20130030078A1 RADICAL-POLYMERIZABLE RESIN, RADICAL-POLYMERIZABLE RESIN COMPOSITION, AND CURED MATERIAL THEREOF Public/Granted day:2013-01-31
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