Invention Grant
- Patent Title: Resin material and high voltage equipment using the resin material
- Patent Title (中): 树脂材料和高压设备使用树脂材料
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Application No.: US13212336Application Date: 2011-08-18
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Publication No.: US08735469B2Publication Date: 2014-05-27
- Inventor: Akihiro Sano , Atsushi Ohtake
- Applicant: Akihiro Sano , Atsushi Ohtake
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2010-204208 20100913
- Main IPC: C08L63/00
- IPC: C08L63/00 ; H01B3/00 ; C08G59/00

Abstract:
A resin material of high strength and high voltage equipment capable of improving the reliability by using the resin material, the resin material being a hardened product including fine particles and resin ingredients, in which the fine particles have hydrophobic groups on the surface and have a particle diameter of 200 nm or less, the resin ingredients have hydrophilic groups on the side chains, and the fine particles form a plurality of linear aggregates inside the resin, thereby forming a dendritic structure.
Public/Granted literature
- US20120061125A1 RESIN MATERIAL AND HIGH VOLTAGE EQUIPMENT USING THE RESIN MATERIAL Public/Granted day:2012-03-15
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