Invention Grant
- Patent Title: Solvent bondable thermoplastic elastomers
- Patent Title (中): 溶剂可粘合热塑性弹性体
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Application No.: US13140013Application Date: 2009-12-01
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Publication No.: US08735491B2Publication Date: 2014-05-27
- Inventor: Sehyun Kim , Wayne Thornton
- Applicant: Sehyun Kim , Wayne Thornton
- Applicant Address: US OH Avon Lake
- Assignee: PolyOne Corporation
- Current Assignee: PolyOne Corporation
- Current Assignee Address: US OH Avon Lake
- Agent John H. Hornickel; Michael J. Sambrook
- International Application: PCT/US2009/066270 WO 20091201
- International Announcement: WO2010/074896 WO 20100701
- Main IPC: C08L9/06
- IPC: C08L9/06 ; C08K5/09

Abstract:
An essentially halogen-free, plasticizer-free thermoplastic elastomer compound is disclosed. The compound has from 10-80 weight percent of a hydrogenated styrene butadiene copolymer having a styrene content of less than 20 weight percent; from 20-90 weight percent of a polyolefin; and less than about 3 weight percent of antioxidant. The compound is capable of being solvent bonded or welded to another thermoplastic material using cyclohexanone alone or with methyl ethyl ketone. The compound is especially useful as medical tubing connected to other parts of medical equipment. The bond strength of the compound to the other thermoplastic material is properly determined only after multiple days of bonding.
Public/Granted literature
- US20110251596A1 SOLVENT BONDABLE THERMOPLASTIC ELASTOMERS Public/Granted day:2011-10-13
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