A curing resin composition that cures in two stages: photo cure and thermal cure, hardly contaminates a liquid or liquid crystals when in contact with, and provides high adhesive strength, particularly a curing composition that photocures sufficiently even when shadowed by TFT wires, a black matrix, etc. in photocuring; and a sealant, a sealant for ODF (one-drop-fill), and an LCD containing the curing resin composition. The curing resin composition contains (A) an oxime ester radical initiator represented by general formula (I), where symbols are as defined in the description, (B) a radical curing resin, (C) a latent epoxy curing agent, and (D) an epoxy resin