Invention Grant
US08735733B2 Resin composition, prepreg laminate obtained with the same and printed-wiring board
有权
树脂组合物，用相同的印刷线路板获得的预浸料层压板
- Patent Title: Resin composition, prepreg laminate obtained with the same and printed-wiring board
- Patent Title (中): 树脂组合物，用相同的印刷线路板获得的预浸料层压板
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Application No.: US13352819Application Date: 2012-01-18
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Publication No.: US08735733B2Publication Date: 2014-05-27
- Inventor: Masato Miyatake , Tomohiko Kotake , Shunsuke Nagai , Shintaro Hashimoto , Yasuo Inoue , Shin Takanezawa , Hikari Murai
- Applicant: Masato Miyatake , Tomohiko Kotake , Shunsuke Nagai , Shintaro Hashimoto , Yasuo Inoue , Shin Takanezawa , Hikari Murai
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Main IPC: E04B1/78
- IPC: E04B1/78 ; B32B27/04 ; B32B27/34 ; H05K1/00
Abstract:
Disclosed are a resin composition containing (a) a maleimide compound having at least two N-substituted maleimide groups in a molecular structure and (b) a silicone compound having at least one reactive organic group in a molecular structure thereof; and a prepreg using the same, a laminate, and a printed wiring board.A resin composition having excellent heat resistance and low thermal expansion properties; and a prepreg, a laminate, and a printed wiring board using the same can be provided.
Public/Granted literature
- US20120247820A1 RESIN COMPOSITION, PREPREG LAMINATE OBTAINED WITH THE SAME AND PRINTED-WIRING BOARD Public/Granted day:2012-10-04
Information query
IPC分类:
