Invention Grant
- Patent Title: Substrate having leads
- Patent Title (中): 基片有引线
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Application No.: US12782861Application Date: 2010-05-19
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Publication No.: US08735737B2Publication Date: 2014-05-27
- Inventor: Yoshihiro Ihara , Takehito Terasawa , Masakuni Kitajima
- Applicant: Yoshihiro Ihara , Takehito Terasawa , Masakuni Kitajima
- Applicant Address: JP Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano
- Agency: IPUSA, PLLC
- Priority: JP2009-128785 20090528
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H01R12/57

Abstract:
A substrate includes a substrate base, first contact parts arranged in a pattern on a surface of the substrate base, and leads respectively having a generally U-shape with a flexible part, a first end fixed to a corresponding one of the first contact parts, and a second end that is located a predetermined distance away from the first end relative to the surface of the substrate base. The first and second ends of each of the leads are substantially aligned in a direction perpendicular to the surface of the substrate base in a state where the second end of each lead is pushed by a target object and deformed thereby in order to electrically connect the substrate to the target object.
Public/Granted literature
- US20100300742A1 SUBSTRATE HAVING LEADS Public/Granted day:2010-12-02
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