Invention Grant
- Patent Title: Molded microwave field director structure
- Patent Title (中): 模制微波场导演结构
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Application No.: US12249070Application Date: 2008-10-10
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Publication No.: US08735785B2Publication Date: 2014-05-27
- Inventor: William R. Corcoran, Jr.
- Applicant: William R. Corcoran, Jr.
- Applicant Address: US DE Wilmington
- Assignee: E I du Pont de Nemours and Company
- Current Assignee: E I du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: H05B6/80
- IPC: H05B6/80

Abstract:
A reusable self-supporting field director structure for use in heating an article in a microwave oven is characterized by an integral array of rigid vanes extending radially outwardly from a central axis, the vanes being molded from an electrically non-conductive heat-resistant material. At least a portion of one major surface of each vane has an electrically conductive material embedded thereinto. The electrically non-conductive heat-resistant material is either a polymeric resin (with an optional reinforcing matrix) or paperboard material. A plurality of bracing members, each extending between the first major surface of one vane and the second major surface of an adjacent vane, may be integrally molded into the field director structure.
Public/Granted literature
- US20090095743A1 Molded Microwave Field Director Structure Public/Granted day:2009-04-16
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