Invention Grant
- Patent Title: Semiconductor storage device and method of manufacturing same
- Patent Title (中): 半导体存储装置及其制造方法
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Application No.: US13777052Application Date: 2013-02-26
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Publication No.: US08735861B2Publication Date: 2014-05-27
- Inventor: Kotaro Noda
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L29/02
- IPC: H01L29/02

Abstract:
A semiconductor storage device according to an embodiment includes a first conductive layer, a variable resistance layer, an electrode layer, a first liner layer, a stopper layer, and a second conductive layer. The first liner layer is configured by a material having a property for canceling an influence of an orientation of a lower layer of the first liner layer, the property of the first liner layer being superior compared with that of the stopper layer. The stopper layer is acted upon by an internal stress in a compressive direction at room temperature.
Public/Granted literature
- US20140061566A1 SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING SAME Public/Granted day:2014-03-06
Information query
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