Invention Grant
- Patent Title: Light emitting semiconductor structure
- Patent Title (中): 发光半导体结构
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Application No.: US13078541Application Date: 2011-04-01
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Publication No.: US08735913B2Publication Date: 2014-05-27
- Inventor: Wu-Cheng Kuo
- Applicant: Wu-Cheng Kuo
- Applicant Address: TW Hsin-Chu TW Chu-Nan, Miao-Li County
- Assignee: VisEra Technologies Company Limited,SemiLEDS Optoelectronics Co., Ltd.
- Current Assignee: VisEra Technologies Company Limited,SemiLEDS Optoelectronics Co., Ltd.
- Current Assignee Address: TW Hsin-Chu TW Chu-Nan, Miao-Li County
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
The invention provides a light emitting semiconductor structure, which includes a substrate; a first LED chip formed on the substrate; an adhesion layer formed on the first LED chip; and a second light emitting diode chip formed on the adhesion layer, wherein the second LED chip has a first conductive wire which is electrically connected to the substrate.
Public/Granted literature
- US20120248473A1 LIGHT EMITTING SEMICONDUCTOR STRUCTURE Public/Granted day:2012-10-04
Information query
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