Invention Grant
- Patent Title: Semiconductor light emitting device and manufacturing method of the same
- Patent Title (中): 半导体发光器件及其制造方法
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Application No.: US13679212Application Date: 2012-11-16
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Publication No.: US08735926B2Publication Date: 2014-05-27
- Inventor: Takaaki Sakai , Takeshi Waragaya
- Applicant: Stanley Electric Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Stanley Electric Co., Ltd.
- Current Assignee: Stanley Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2011-253442 20111121
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A semiconductor light emitting device which has a wavelength converting part on a semiconductor film and can eliminate unevenness in emission color without a reduction in light output. The semiconductor film includes a light emitting layer. The support substrate is bonded to the semiconductor film via a light-reflecting layer and has a support surface supporting the semiconductor film and edges located further out than the side surfaces of the semiconductor film. The light-shielding part covers the side surfaces of the semiconductor film and part of the support surface around the semiconductor film in plan view. The wavelength converting part contains a fluorescent substance and is provided over the support substrate to bury the semiconductor film and the light-shielding part therein. The wavelength converting part has a curved surface shape in which its thickness increases when going from the edges toward the center of the semiconductor film.
Public/Granted literature
- US20130126926A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2013-05-23
Information query
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