Invention Grant
- Patent Title: Fully isolated LIGBT and methods for forming the same
- Patent Title (中): 完全隔离的LIGBT及其形成方法
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Application No.: US13601229Application Date: 2012-08-31
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Publication No.: US08735937B2Publication Date: 2014-05-27
- Inventor: Jhy-Jyi Sze , Biay-Cheng Hseih , Shou-Gwo Wuu
- Applicant: Jhy-Jyi Sze , Biay-Cheng Hseih , Shou-Gwo Wuu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/70

Abstract:
A device includes a dielectric layer, and a heavily doped semiconductor layer over the dielectric layer. The heavily doped semiconductor layer is of a first conductivity type. A semiconductor region is over the heavily doped semiconductor layer, wherein the semiconductor region is of a second conductivity type opposite the first conductivity type. A Lateral Insulated Gate Bipolar Transistor (LIGBT) is disposed at a surface of the semiconductor region.
Public/Granted literature
- US20130320397A1 Fully Isolated LIGBT and Methods for Forming the Same Public/Granted day:2013-12-05
Information query
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