Invention Grant
- Patent Title: Solid state imaging device
- Patent Title (中): 固态成像装置
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Application No.: US13371712Application Date: 2012-02-13
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Publication No.: US08735939B2Publication Date: 2014-05-27
- Inventor: Koichi Kokubun
- Applicant: Koichi Kokubun
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-098518 20110426
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
According to one embodiment, a solid state imaging device includes a photoelectric converting portion including a semiconductor region and a semiconductor film. The semiconductor region has a first region and a second region. The first region is of a second conductivity type. The first region is provided in a semiconductor substrate. The second region is of a first conductivity type. The first conductivity type is a different conductivity type from the second conductivity type. The second region is provided on the first region. The semiconductor film is of the second conductivity type. The semiconductor film is provided on the semiconductor region. An absorption coefficient of a material of the semiconductor film to a visible light is higher than an absorption coefficient of a material of the semiconductor substrate to the visible light. A thickness of the semiconductor film is smaller than a thickness of the semiconductor region.
Public/Granted literature
- US20120273837A1 SOLID STATE IMAGING DEVICE Public/Granted day:2012-11-01
Information query
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