Invention Grant
- Patent Title: Compound semiconductor device and manufacturing method of the same
- Patent Title (中): 复合半导体器件及其制造方法
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Application No.: US13396899Application Date: 2012-02-15
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Publication No.: US08735942B2Publication Date: 2014-05-27
- Inventor: Tadahiro Imada , Atsushi Yamada
- Applicant: Tadahiro Imada , Atsushi Yamada
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2008-334793 20081226
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
An i-GaN layer (electron transit layer), an n-GaN layer (compound semiconductor layer) formed over the i-GaN layer (electron transit layer), and a source electrode, a drain electrode and a gate electrode formed over the n-GaN layer (compound semiconductor layer) are provided. A recess portion is formed inside an area between the source electrode and the drain electrode of the n-GaN layer (compound semiconductor layer) and at a portion separating from the gate electrode.
Public/Granted literature
- US20120139008A1 COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2012-06-07
Information query
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