Invention Grant
US08735951B2 Semiconductor device having diffusion barrier element injection region
有权
具有扩散势垒元件注入区域的半导体器件
- Patent Title: Semiconductor device having diffusion barrier element injection region
- Patent Title (中): 具有扩散势垒元件注入区域的半导体器件
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Application No.: US13327960Application Date: 2011-12-16
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Publication No.: US08735951B2Publication Date: 2014-05-27
- Inventor: Hajin Lim , Moonhan Park , Jinho Do , Moonkyun Song
- Applicant: Hajin Lim , Moonhan Park , Jinho Do , Moonkyun Song
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2010-0133494 20101223
- Main IPC: H01L29/78
- IPC: H01L29/78

Abstract:
A semiconductor device includes an isolation pattern disposed on a substrate, the isolation pattern defining an active part, a gate pattern crossing the active part on the substrate, the gate pattern including a dielectric pattern and a first conductive pattern, and the dielectric pattern being between the active part and the first conductive pattern, a pair of doping regions in the active part adjacent to side walls of the gate pattern, the gate pattern being between the pair of doping regions, and a diffusion barrier element injection region disposed in an upper region of the active part.
Public/Granted literature
- US20120161211A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-06-28
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