Invention Grant
- Patent Title: Forming structures on resistive substrates
- Patent Title (中): 在电阻基板上形成结构
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Application No.: US13312442Application Date: 2011-12-06
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Publication No.: US08735986B2Publication Date: 2014-05-27
- Inventor: Alan B. Botula , Renata Camillo-Castillo , James S. Dunn , Jeffrey P. Gambino , Douglas B. Hershberger , Alvin J. Joseph , Robert M. Rassel , Mark E. Stidham
- Applicant: Alan B. Botula , Renata Camillo-Castillo , James S. Dunn , Jeffrey P. Gambino , Douglas B. Hershberger , Alvin J. Joseph , Robert M. Rassel , Mark E. Stidham
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Michael LeStrange
- Main IPC: H01L27/12
- IPC: H01L27/12

Abstract:
A substrate includes a first region having a first resistivity, for optimizing a field effect transistor, a second region having a second resistivity, for optimizing an npn subcollector of a bipolar transistor device and triple well, a third region having a third resistivity, with a high resistivity for a passive device, a fourth region, substantially without implantation, to provide low perimeter capacitance for devices.
Public/Granted literature
- US20130140668A1 Forming Structures on Resistive Substrates Public/Granted day:2013-06-06
Information query
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