Invention Grant
- Patent Title: Radiation hardened FinFET
- Patent Title (中): 辐射硬化FinFET
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Application No.: US11679869Application Date: 2007-02-28
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Publication No.: US08735990B2Publication Date: 2014-05-27
- Inventor: Brent A. Anderson , Robert H. Dennard , Mark C. Hakey , Edward J. Nowak
- Applicant: Brent A. Anderson , Robert H. Dennard , Mark C. Hakey , Edward J. Nowak
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Gibb & Riley, LLC
- Agent Richard M. Kotulak, Esq.
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L27/085 ; H01L29/06

Abstract:
The embodiments of the invention provide a structure and method for a rad-hard FinFET or mesa. More specifically, a semiconductor structure is provided having at least one fin or mesa comprising a channel region on an isolation region. A doped substrate region is also provided below the fin, wherein the doped substrate region has a first polarity opposite a second polarity of the channel region. The isolation region contacts the doped substrate region. The structure further includes a gate electrode covering the channel region and at least a portion of the isolation region. The gate electrode comprises a lower portion below the channel region of the fin, wherein the lower portion of the gate electrode comprises a height that is at least one-half of a thickness of the fin.
Public/Granted literature
- US20080203491A1 RADIATION HARDENED FINFET Public/Granted day:2008-08-28
Information query
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