Invention Grant
- Patent Title: High gate density devices and methods
- Patent Title (中): 高栅极密度器件和方法
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Application No.: US13308671Application Date: 2011-12-01
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Publication No.: US08735991B2Publication Date: 2014-05-27
- Inventor: Ming-Feng Shieh , Chang-Yun Chang , Hsin-Chih Chen
- Applicant: Ming-Feng Shieh , Chang-Yun Chang , Hsin-Chih Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/70
- IPC: H01L21/70

Abstract:
A semiconductor device with an isolation feature is disclosed. The semiconductor device includes a plurality of gate structures disposed on a semiconductor substrate, a plurality of gate sidewall spacers of a dielectric material formed on respective sidewalls of the plurality of gate structures, an interlayer dielectric (ILD) disposed on the semiconductor substrate and the gate structures, an isolation feature embedded in the semiconductor substrate and extended to the ILD and a sidewall spacer of the dielectric material disposed on sidewalls of extended portion of the isolation feature.
Public/Granted literature
- US20130140639A1 HIGH GATE DENSITY DEVICES AND METHODS Public/Granted day:2013-06-06
Information query
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