Invention Grant
- Patent Title: Semiconductor apparatus
- Patent Title (中): 半导体装置
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Application No.: US13552230Application Date: 2012-07-18
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Publication No.: US08736029B2Publication Date: 2014-05-27
- Inventor: Keigo Sato
- Applicant: Keigo Sato
- Applicant Address: JP Toyota-Shi
- Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Toyota-Shi
- Agency: Kenyon & Kenyon LLP
- Main IPC: H01L29/02
- IPC: H01L29/02

Abstract:
A semiconductor apparatus includes a semiconductor substrate. The semiconductor substrate includes an active region in which a semiconductor device is formed, and a peripheral region which is located between the active region and an edge surface of the semiconductor substrate. A first insulating layer including conductive particles is formed above at least a part of the peripheral region. By constructing the semiconductor apparatus in this manner, generation of a high electric field in the peripheral region can be suppressed. Therefore, voltage endurance characteristics of the semiconductor apparatus can be improved.
Public/Granted literature
- US20130105933A1 SEMICONDUCTOR APPARATUS Public/Granted day:2013-05-02
Information query
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