Invention Grant
- Patent Title: Semiconductor package
- Patent Title (中): 半导体封装
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Application No.: US13200406Application Date: 2011-09-23
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Publication No.: US08736031B2Publication Date: 2014-05-27
- Inventor: Jung Aun Lee , Myeong Woo Han , Do Jae Yoo , Chul Gyun Park
- Applicant: Jung Aun Lee , Myeong Woo Han , Do Jae Yoo , Chul Gyun Park
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2011-0068930 20110712
- Main IPC: H01L23/552
- IPC: H01L23/552
Abstract:
There is provided a semiconductor package, and more particularly, a semiconductor package including an antenna embedded in an inner portion thereof. The semiconductor package includes: a semiconductor chip; a main antenna disposed to be adjacent to the semiconductor chip and electrically connected thereto; a sealing part sealing both of the semiconductor chip and the main antenna; and an auxiliary antenna formed on an outer surface of the sealing part and coupled to the main antenna.
Public/Granted literature
- US20130015563A1 Semiconductor package Public/Granted day:2013-01-17
Information query
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