Invention Grant
US08736038B2 Lead frame having increased stability due to reinforced die pads and packaging method using such lead frame
有权
引线框架由于增强的芯片焊盘而增加的稳定性以及使用这种引线框架的封装方法
- Patent Title: Lead frame having increased stability due to reinforced die pads and packaging method using such lead frame
- Patent Title (中): 引线框架由于增强的芯片焊盘而增加的稳定性以及使用这种引线框架的封装方法
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Application No.: US13615185Application Date: 2012-09-13
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Publication No.: US08736038B2Publication Date: 2014-05-27
- Inventor: Hui Jun Xiong , Pierangelo Magni
- Applicant: Hui Jun Xiong , Pierangelo Magni
- Applicant Address: IT Agrate Brianza (MB) CN Shenzhen
- Assignee: STMicroelectronics S.r.l.,STMicroelectronics (Shenzhen) Manufacturing Co., Ltd.
- Current Assignee: STMicroelectronics S.r.l.,STMicroelectronics (Shenzhen) Manufacturing Co., Ltd.
- Current Assignee Address: IT Agrate Brianza (MB) CN Shenzhen
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: CN201110304978 20110927
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/48 ; H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
There is provided a lead frame and a packaging method. The lead frame comprises a first plurality of die pads, a second plurality of leads extending from the first plurality of die pads, and a third plurality of tie elements, each of which connects one of the first plurality of die pads to another.
Public/Granted literature
- US20130075885A1 LEAD FRAME AND PACKAGING METHOD Public/Granted day:2013-03-28
Information query
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