Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13526821Application Date: 2012-06-19
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Publication No.: US08736053B2Publication Date: 2014-05-27
- Inventor: Koichi Tanaka , Nobuyuki Kurashima , Hajime Iizuka , Tetsuya Koyama
- Applicant: Koichi Tanaka , Nobuyuki Kurashima , Hajime Iizuka , Tetsuya Koyama
- Applicant Address: JP Nagano-shi, Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi, Nagano
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2011-136474 20110620
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A circuit substrate having a mounting surface on which a semiconductor chip is mounted and at least one connection pad formed on the mounting surface is connected to a support plate having at least one mounting portion with a diameter larger than a diameter of the connection pad, through a truncated-cone-shaped solder layer which is formed from at least one solder ball on the basis of a difference between the diameter of the mounting portion and the diameter of the connection pad.
Public/Granted literature
- US20120319274A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Public/Granted day:2012-12-20
Information query
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