Invention Grant
- Patent Title: Chip package and method for assembling chip package
- Patent Title (中): 芯片封装及组装芯片封装方法
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Application No.: US13534247Application Date: 2012-06-27
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Publication No.: US08736078B2Publication Date: 2014-05-27
- Inventor: Kai-Wen Wu
- Applicant: Kai-Wen Wu
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: TW101113862A 20120418
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A chip package includes a PCB, a connecting pad fixed on a surface of the PCB and a chip fixed on the connecting pad. The connecting pad includes a first metal film on its surface facing away from the PCB. The chip includes a second metal film formed on its surface opposite to the PCB. The first and the second metal are connected to each other via a eutectic manner.
Public/Granted literature
- US20130277847A1 CHIP PACKAGE AND METHOD FOR ASSEMBLING CHIP PACKAGE Public/Granted day:2013-10-24
Information query
IPC分类:
