Invention Grant
- Patent Title: Pad structure, circuit carrier and integrated circuit chip
- Patent Title (中): 垫结构，电路载体和集成电路芯片
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Application No.: US13190486Application Date: 2011-07-26
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Publication No.: US08736079B2Publication Date: 2014-05-27
- Inventor: Yu-Kai Chen , Yeh-Chi Hsu
- Applicant: Yu-Kai Chen , Yeh-Chi Hsu
- Applicant Address: TW New Taipei
- Assignee: VIA Technologies, Inc.
- Current Assignee: VIA Technologies, Inc.
- Current Assignee Address: TW New Taipei
- Agency: Jianq Chyun IP Office
- Priority: TW100117982A 20110523
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A pad structure is suitable for a circuit carrier or an integrated circuit chip. The pad structure includes an inner pad, a conductive via and an outer pad. The conductive via connects the inner pad. The outer pad connects the conductive via and further connects a conductive ball or a conductive bump. The outer diameter of the outer pad is greater than the outer diameter of the inner pad.
Public/Granted literature
- US20120299192A1 PAD STRUCTURE, CIRCUIT CARRIER AND INTEGRATED CIRCUIT CHIP Public/Granted day:2012-11-29
Information query
IPC分类:
