Invention Grant
- Patent Title: Coupling device and method of manufacturing coupling device
- Patent Title (中): 耦合装置及制造耦合装置的方法
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Application No.: US13561290Application Date: 2012-07-30
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Publication No.: US08736125B2Publication Date: 2014-05-27
- Inventor: Hiromitsu Ohhashi , Junichi Sutani
- Applicant: Hiromitsu Ohhashi , Junichi Sutani
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2010-113320 20100517
- Main IPC: H02K49/02
- IPC: H02K49/02

Abstract:
This coupling device includes a magnet rotator and a yoke-side member, while a conductor portion of the yoke-side member has a plurality of first conductor portions at least on a side opposed to magnets. A yoke of the yoke-side member is arranged at least on the side opposed to the magnets in a clearance between the plurality of first conductor portions. The ratio of the circumferential length of each of the first conductor portions to the circumferential length of the yoke is at least 1/1.4.
Public/Granted literature
- US20120306306A1 COUPLING DEVICE AND METHOD OF MANUFACTURING COUPLING DEVICE Public/Granted day:2012-12-06
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