Invention Grant
- Patent Title: Reconfigurable integrated circuit
- Patent Title (中): 可重构集成电路
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Application No.: US13609283Application Date: 2012-09-11
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Publication No.: US08736302B2Publication Date: 2014-05-27
- Inventor: Xu Zhang , Chad J. Lerma , Kai Liu , Sian Lu , Hao Wang , Shayan Zhang , Wanggen Zhang
- Applicant: Xu Zhang , Chad J. Lerma , Kai Liu , Sian Lu , Hao Wang , Shayan Zhang , Wanggen Zhang
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent Charles Bergere
- Priority: CN201210141356 20120509
- Main IPC: H03K19/173
- IPC: H03K19/173 ; H03K19/00 ; H01L25/00

Abstract:
A reconfigurable integrated circuit (IC) has IC interface terminals including circuit input terminals and circuit output terminals. A bypass controller and bypass circuitry are coupled to each other, and to at least one of the circuit input terminals and at least one of the circuit output terminals. A processing circuit has multiple circuit modules coupled to the bypass circuitry. The processing circuit is coupled to at least one of the circuit input terminals and at least one of the circuit output terminals. In operation the bypass controller controls the bypass circuitry to selectively couple at least one pair of the IC interface terminals together, the pair including one of the circuit input terminals and one of the circuit output terminals. When the pair of IC interface terminals are coupled together, at least one of the circuit modules is selectively de-coupled from the pair of the IC terminals.
Public/Granted literature
- US20130300497A1 RECONFIGURABLE INTEGRATED CIRCUIT Public/Granted day:2013-11-14
Information query
IPC分类: