Invention Grant
- Patent Title: Solid-state imaging device and method for manufacturing the same, and electronic apparatus and camera module
- Patent Title (中): 固态成像装置及其制造方法，以及电子装置和相机模块
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Application No.: US13071703Application Date: 2011-03-25
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Publication No.: US08736727B2Publication Date: 2014-05-27
- Inventor: Atsuhiro Ando
- Applicant: Atsuhiro Ando
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JP2010-086162 20100402
- Main IPC: H04N3/14
- IPC: H04N3/14
Abstract:
A solid-state imaging device includes a photoelectric conversion portion, a charge-receiving portion to which charges are transferred from the photoelectric conversion portion, and a light control film having a reverse tapered opening over the photoelectric conversion portion to reduce the intensity of diffracted light diffusing to regions other than the photoelectric conversion portion.
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