An imaging device 100 includes: an imaging element 110; a main circuit substrate 120; a mounting component 130 mounting the imaging element 110; a metal plate 150 disposed between the mounting component 130 and the main circuit substrate 120; a mount 140 supporting the metal plate 150 by connection sections 160 being fixed at at least three fixing points; elastic components 165 urging the connection sections 160 at each fixing point of the mount 140; and an electrically-conductive component 190 electrically connecting between a ground conductor of the main circuit substrate 120 and the metal plate 150. The electrically-conductive component 190 is disposed such that a connection point with the metal plate 150 is positioned in a area formed by the at least three fixing points being sequentially connected in the case of a back surface of the metal plate 150 being viewed in a direction orthogonal thereto.