Invention Grant
- Patent Title: High speed serial link systems
- Patent Title (中): 高速串行链路系统
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Application No.: US12550475Application Date: 2009-08-31
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Publication No.: US08737450B2Publication Date: 2014-05-27
- Inventor: Shun-Cheng Yang
- Applicant: Shun-Cheng Yang
- Applicant Address: TW Hsin-Tien, Taipei
- Assignee: Via Technologies, Inc.
- Current Assignee: Via Technologies, Inc.
- Current Assignee Address: TW Hsin-Tien, Taipei
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW98122733A 20090706
- Main IPC: H04B1/00
- IPC: H04B1/00
Abstract:
High speed serial link techniques are provided. A system applying the high speed serial link technique comprises a relay unit and an amplifier. The relay unit receives a first pair of differential signals provided by a high speed transmitter of a first device, and provides the amplifier with at least one signal that is generated based on the first pair of differential signals. The amplifier amplifies and converts the signal provided by the relay unit to a second pair of differential signals to be received by a high speed receiver of a second device.
Public/Granted literature
- US20110002368A1 HIGH SPEED SERIAL LINK SYSTEMS Public/Granted day:2011-01-06
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