It is an object to provide an electronic component mounting method that makes it possible to assure stable pickup operation even when a dimensional error attributable to a difference in production lot exists in electronic components or carrier tapes. During electronic component mounting adopting a tape splicing technique for splicing a carrier tape 15 already loaded on a tape feeder to a newly loaded carrier tape 15A, when an optical sensor 30 has detected a joint J between the already-loaded carrier tape 15 and the newly-loaded carrier tape 15A, a height measurement device 12 performs measurement of a component pickup height targeted for components P housed in the carrier tape 15A in connection with the tape feeder for which the joint J has been detected. Component pickup height data showing a target lowering height to which pickup nozzles 10a are to be lowered are updated on the basis of the measurement result.