Invention Grant
- Patent Title: Structure for mounting power supply device in vehicle
- Patent Title (中): 车载电源装置结构
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Application No.: US13834546Application Date: 2013-03-15
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Publication No.: US08739911B2Publication Date: 2014-06-03
- Inventor: Takashi Katou , Junichi Kojima , Sadayuki Asano
- Applicant: Honda Motor Co., Ltd
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd
- Current Assignee: Honda Motor Co., Ltd
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2012-095051 20120418
- Main IPC: B60R16/04
- IPC: B60R16/04
Abstract:
A structure for mounting a power supply device in a vehicle includes: a rear bulkhead that separates a cabin and a rear trunk; and a power supply device that is disposed in the rear trunk while opposing the rear bulkhead and that has upper, right, left and rear surfaces covered by a metal cover.
Public/Granted literature
- US20130277130A1 STRUCTURE FOR MOUNTING POWER SUPPLY DEVICE IN VEHICLE Public/Granted day:2013-10-24
Information query
