Invention Grant
- Patent Title: Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the same
- Patent Title (中): 电子设备的制造方法，电子部件安装基板及其制造方法
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Application No.: US14023608Application Date: 2013-09-11
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Publication No.: US08740047B2Publication Date: 2014-06-03
- Inventor: Seiki Sakuyama , Toshiya Akamatsu , Masateru Koide
- Applicant: Fujitsu Limited
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Main IPC: B23K31/02
- IPC: B23K31/02 ; H01L29/40
Abstract:
A method of manufacturing an electronic apparatus including a first and a second components, includes: forming a first solder bump on one of the first component and the second component; forming a second solder bump on the other one of the first component and the second component; bringing the first solder bump into contact with the second solder bump at a temperature higher than the liquidus temperature of any of the first and the second solder bumps such that the first and the second solder bumps are fused together to form a solder joint of an alloy having a lower liquidus temperature than any of the first and the second solder bumps; and solidifying the solder joint between the first and the second component.
Public/Granted literature
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