Invention Grant
- Patent Title: IC tag and electronic apparatus
- Patent Title (中): IC标签和电子设备
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Application No.: US13531850Application Date: 2012-06-25
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Publication No.: US08740092B2Publication Date: 2014-06-03
- Inventor: Yuji Sakai
- Applicant: Yuji Sakai
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sony Corporation of America
- Priority: JP2011-149464 20110705
- Main IPC: G06K19/06
- IPC: G06K19/06

Abstract:
There is provided an IC tag, including a substrate made of a dielectric material, an antenna pattern disposed on a surface of the substrate, a communication circuit chip connected to one end and other end of the antenna pattern on the substrate surface, which performs transmission processing and/or reception processing of a radio signal, and external circuit connection parts connected to the antenna pattern in a vicinity of the one end and the other end thereof on the surface or a rear surface of the substrate, in which a conductive part having a predetermined area opposes to other conductive part having a predetermined area on an opposed surface at an opposite side of the substrate, and the conductive part on the opposed surface at the opposite side is formed as a pad to be connected to an external circuit.
Public/Granted literature
- US20130008969A1 IC TAG AND ELECTRONIC APPARATUS Public/Granted day:2013-01-10
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