The present invention generally relates to a ring assembly that may be used in an etching or other plasma processing chamber. The ring assembly generally includes an inner ring and an outer ring disposed radially outward of the inner ring. The inner ring will correspond to the location where the majority of erosion occurs during use. This inner ring can be flipped and reused until both sides have eroded beyond their service life. Collectively, the two rings generally have the shape of a single piece ring, but the service life of the ring assembly is longer than a conventional single piece ring.