Invention Grant
- Patent Title: Liquid ejection head and flexible wiring substrate used in liquid ejection head
- Patent Title (中): 液体喷头和柔性布线基板用于液体喷头
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Application No.: US13284626Application Date: 2011-10-28
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Publication No.: US08740353B2Publication Date: 2014-06-03
- Inventor: Satoshi Kimura , Satoshi Oikawa , Kenji Kitabatake , Yukuo Yamaguchi
- Applicant: Satoshi Kimura , Satoshi Oikawa , Kenji Kitabatake , Yukuo Yamaguchi
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA Inc IP Division
- Priority: JP2010-251157 20101109
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/05
Abstract:
A flexible wiring substrate that is used in a liquid ejection head having an element substrate provided with energy generating elements for generating energy for ejecting liquid includes: a bending portion; a base member including resin; electrical wiring lines formed on the base member and electrically connected to the element substrate, the electrical wiring lines extending over a ridge of the bending portion; and a metal layer that is arranged on an area of the base member in which no electrical wiring lines are provided and that is not electrically connected to the element substrate, the metal layer extending over the ridge.
Public/Granted literature
- US20120113192A1 LIQUID EJECTION HEAD AND FLEXIBLE WIRING SUBSTRATE USED IN LIQUID EJECTION HEAD Public/Granted day:2012-05-10
Information query
IPC分类:
