Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
- Patent Title (中): 液体喷头和液体喷射装置
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Application No.: US13429124Application Date: 2012-03-23
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Publication No.: US08740354B2Publication Date: 2014-06-03
- Inventor: Hajime Nakao , Keiji Hara
- Applicant: Hajime Nakao , Keiji Hara
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2011-066811 20110324
- Main IPC: B41J2/05
- IPC: B41J2/05

Abstract:
A first member and a second member constituting flow passage member are joined at a first joining region that surrounds the periphery of a liquid flow passage and a second joining region that is further to the outside than the first joining region, and in a state where the second joining region has a gas barrier property higher than that of the first joining region, the second joining region seals a gap between the first member and the second member, wherein the liquid ejecting head includes a communication hole that communicates a space between the first member and the second member with the outside, which is surrounded by the first joining region and the second joining region.
Public/Granted literature
- US20120242753A1 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS Public/Granted day:2012-09-27
Information query
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