Invention Grant
- Patent Title: Light-emitting-element mounting package, light emitting device, backlight, and liquid crystal display device
- Patent Title (中): 发光元件安装封装，发光器件，背光源和液晶显示器件
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Application No.: US12710689Application Date: 2010-02-23
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Publication No.: US08740409B2Publication Date: 2014-06-03
- Inventor: Hidehiko Nakata , Takayuki Kawasumi , Akihiko Memezawa
- Applicant: Hidehiko Nakata , Takayuki Kawasumi , Akihiko Memezawa
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-058388 20090311
- Main IPC: F21S8/02
- IPC: F21S8/02
Abstract:
A small and thin, light-emitting-element mounting package is provided, in which light emitting elements may by independently controlled despite a side view type package, and a light emitting device using the package is provided. The light-emitting-element mounting package includes a lead frame. The lead frame has at least one set of a structure including a lower conductor layer, an insulating layer and an upper conductor layer in this order, and a mounting area exposed on a surface of the lower conductor layer.
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