Invention Grant
- Patent Title: Backlight assembly and method of assembling a backlight assembly
- Patent Title (中): 背光组件和组装背光组件的方法
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Application No.: US13461494Application Date: 2012-05-01
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Publication No.: US08740445B2Publication Date: 2014-06-03
- Inventor: Sang-Hwan Lee
- Applicant: Sang-Hwan Lee
- Applicant Address: KR
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2011-0044896 20110513
- Main IPC: F21V7/04
- IPC: F21V7/04

Abstract:
A backlight assembly includes a first light-emitting module, a light guide plate, a receiving container and a main adhesion member. The first light-emitting module includes a first circuit board including a first mounting surface, and a first light source on the first mounting surface. The light guide plate is on the first mounting surface and guides light from the first light source. The receiving container includes a bottom portion and receives the first light-emitting module and the light guide plate. The main adhesion member is between the first mounting surface and the light guide plate and is attached to the first circuit board and the light guide plate, and is between the light guide plate and the bottom portion and movable with respect to the light guide plate.
Public/Granted literature
- US20120287672A1 BACKLIGHT ASSEMBLY AND METHOD OF ASSEMBLING A BACKLIGHT ASSEMBLY Public/Granted day:2012-11-15
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