Invention Grant
US08740535B2 Delivery position aligning method for use in vacuum processing apparatus, vacuum processing apparatus and computer storage medium
有权
用于真空处理装置，真空处理装置和计算机存储介质的输送位置对准方法
- Patent Title: Delivery position aligning method for use in vacuum processing apparatus, vacuum processing apparatus and computer storage medium
- Patent Title (中): 用于真空处理装置，真空处理装置和计算机存储介质的输送位置对准方法
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Application No.: US13079356Application Date: 2011-04-04
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Publication No.: US08740535B2Publication Date: 2014-06-03
- Inventor: Keisuke Kondoh , Hiroshi Koizumi
- Applicant: Keisuke Kondoh , Hiroshi Koizumi
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: JP2006-076190 20060320
- Main IPC: H01L21/677
- IPC: H01L21/677
Abstract:
In a vacuum transfer chamber, a position detecting mechanism for detecting the positions of semiconductor wafers is arranged. The semiconductor wafers disposed at predetermined positions in a load lock chamber and vacuum processing chambers are transferred to the position detecting mechanism by a vacuum transfer mechanism and the positions of the wafers are detected. Then, based on the detection results, aligning between the load lock chamber and the vacuum processing chambers is performed.
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Information query
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