Invention Grant
- Patent Title: Workpiece removal and finishing device
- Patent Title (中): 工件拆卸和整理装置
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Application No.: US14009472Application Date: 2012-04-02
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Publication No.: US08740608B2Publication Date: 2014-06-03
- Inventor: Norio Tanaka , Atsushi Ikeda , Takaaki Hoshi
- Applicant: Norio Tanaka , Atsushi Ikeda , Takaaki Hoshi
- Applicant Address: JP Isesaki-shi
- Assignee: Nihon Shoryoku Kikai Co., Ltd.
- Current Assignee: Nihon Shoryoku Kikai Co., Ltd.
- Current Assignee Address: JP Isesaki-shi
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2011-083233 20110405
- International Application: PCT/JP2012/058910 WO 20120402
- International Announcement: WO2012/137725 WO 20121011
- Main IPC: B29C37/00
- IPC: B29C37/00

Abstract:
There is provided a workpiece removal and finishing device that can easily, accurately, continuously and quickly perform a series of works for processing a workpiece of resin removed from a molding machine. The workpiece removal and finishing device for processing the workpiece of resin removed from the molding machine 41 has a workpiece removal robot 100 for directly or indirectly removing the workpiece from molds 2, 3, and a processing robot 200 for processing the workpiece. A processing tool which can profile the workpiece is secured to the arm tip of the processing robot 200 through a floating mechanism to be adaptable to thermal contraction of the workpiece, and the workpiece can processed by the profiling-capable processing tool provided to the arm tip 200A of the processing robot 200 while the workpiece removed by the workpiece removal robot 100 is positioned and held by the workpiece removal robot 100.
Public/Granted literature
- US20140017352A1 WORKPIECE REMOVAL AND FINISHING DEVICE Public/Granted day:2014-01-16
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