Invention Grant
- Patent Title: Header assembly
- Patent Title (中): 标题组件
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Application No.: US13689291Application Date: 2012-11-29
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Publication No.: US08740629B1Publication Date: 2014-06-03
- Inventor: John Wesley Hall , Raymond John DeMarchis, Jr. , Douglas John Hardy , Ronald Louis Marion
- Applicant: Tyco Electronics Corporation
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A header assembly includes a conductive outer housing holding a center contact and a dielectric body. The outer housing has a rear shell and an outer contact extending forward from the rear shell. The outer contact has a catch extending therefrom positioned forward of the rear shell. The header assembly includes a nose cone coupled to the outer contact. The nose cone is manufactured from a plastic material. The nose cone surrounds the outer contact. The nose cone has keying ribs along an exterior thereof. The nose cone has a latch engaging the catch to secure the nose cone to the outer housing.
Public/Granted literature
- US20140148052A1 HEADER ASSEMBLY Public/Granted day:2014-05-29
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